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PartNumber: PIB-DH670011
  Shuttle XPC Barbone Slim DH670V2 Intel H670 LGA1700   (Carta di Credito Web ) 329,33 € Aggiungi Prodotto al Carrello
HDMI, DP, 2xDDR4, 1xPCIe X16, SATA, M.2, 2.5G      
    Pagamento e Prezzo si cambiano nel Carrello, inserito il primo articolo.  
         
Marchio:Shuttle        
Codice:361797.01        
PartNumber:PIB-DH670011      
EAN:887993005942         
dispo Disponibile c/o Vendor         
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 Altri articoli del Produttore:  Shuttle      
 Altri articoli nelle Categorie:/ Hardware / Sistemi Desktop / XPC Barebone      
 


XPC slim DH670V2
Robust 1.3-litre Slim PC supports Intel Core processors with Socket LGA1700 and four UHD displays

The Shuttle XPC slim Barebone DH670V2 with H670 chipset houses the performance of Intel's 12th/13th/14th generation*) Core desktop processors (codenamed Alder Lake-S and Raptor Lake-S [Refresh]) for socket LGA1700 in a compact 1.3-litre format. The DH670V2 allows for four Ultra HD displays to be operated at the same time via 2x HDMI and 2x DP. It also offers Dual Intel 2.5G LAN, four USB 3.2 Gen 2 and COM ports. The slim metal chassis comes with a VESA mount included, provides versatile connectivity and reliable operation in environments with ambient temperatures of up to 50 °C. This platform is targeted at professional applications such as Digital Signage, POS, POI, gambling machines, office, healthcare and industry.
*) For Intel Core Gen14, a BIOS update might be necessary (to be performed with a compatible processor)



Chassis
Slim PC with black chassis made of metal
Dimensions: 190 x 165 x 43 mm (LWH) = 1.35-litre
Weight: 1.3 kg net and 2.1 kg gross
Two holes for Kensington Locks and numerous
threaded holes (M3) on both sides of the chassis
Power Adapter
External 120 W power adapter (fanless)
Input: 100~240 V AC, 50/60 Hz
Output: 19 V DC, 6.32 A, max. 120 W
DC Connector: 5.5/2.5 mm (outer/inner diameter)
Remark: The DC-input of the computer supports an external power source with 19V±5%.
AC mains cable: 3 pins, ca. 1.7 m length, with C5/C6 coupler (called "Mickey Mouse" or "Clover-leaf") for the power adapter and CEE-7/7 plug with earth-contact (type E+F) for the power outlet
Operating System
This system comes without an operating system.
It is compatible with Windows 10/11 and Linux (64-bit)
Processor support
Processor Socket LGA1700
Supports Intel Core i9 / i7 / i5 / i3, Pentium Gold and Celeron processors
Supports the following generations of Intel Core processors:
Gen 12 "Alder Lake-S"
Gen 13 "Raptor Lake-S"
Gen 14 "Raptor Lake-S Refresh" since BIOS-Version 210 available since Jan'24 *)
in "Intel 7" process technology (previously Intel 10 nm Enhanced SuperFin)
Supports processors with integrated graphics only [5]
Maximum supported processor power consumption (TDP) = 65 W
Does not Sup. the unlock-function of Intel K-Series processors.
The processor integrates PCI-Express, memory controller
and the graphics engine on the same die.
* Attention: in case an BIOS update is required, the PC must first be started with a compatible processor.
Download-Website: https://global.shuttle.com/Sup./download.
Processor cooling
Heat-pipe processor cooling with two 60 mm fans on the upper side of the chassis
Mainboard / Chipset
Mainboard in a Shuttle form factor proprietary design for the XPC DH670V2
Chipset/Southbridge: Intel® H670
Passive chipset cooling with heat sink
The Northbridge is integrated in the processor.
Solid Capacitors for sensitive areas provide excellent heat resistance for enhanced system durability
BIOS
AMI BIOS, SPI Interface, 16 MB Flash-EEPROM
Supports HW Monitoring and Watchdog functionality
Supports Firmware-TPM (fTPM) v2.0 [9]
Supports boot up from external USB flash memory
Supports Unified Extensible Firmware Interface (UEFI)
Supports power on after power failure [7]
Memory support
2x SO-DIMM slot with 260 pins
Supports DDR4-3200/2933/2666/2400/2133 (PC4-25600/23466/21300/19200/17000) SDRAM at 1.2 V
Supports Dual Channel mode
Supports a maximum of 32 GB per DIMM,
maximum total size: 64 GB
Supports two unbuffered DIMM modules (no ECC or registered)
Integrated Graphics
The features of the integrated Intel UHD graphics function
depend on the processor type used. [5]
The PC features four video outputs which Sup. 1080p/60 and 2160p/60:
2x HDMI v2.0b
2x DP v1.4
Supports displays with 4K Ultra HD resolution at 3840 x 2160
Supports four independent displays with the integrated graphics function
DP and HDMI Sup. multi-channel digital audio over the same cable.
Optional analog D-Sub/VGA video output [4]
Drive bay
1x 6.35 cm / 2.5" storage bay supports one hard disk or SSD drive with SATA connector
Dev. height: 12.5 mm (max.)
SATA connectors
1x Serial-ATA III, 6 Gb/s (600 MB/s) bandwidth
With Serial-ATA power connector (onboard)
M.2-2280M SSD slot
The M.2 2280M slot provides the following interfaces:
PCI-Express Gen. 4.0 X4, supports NVMe
SATA v3.0 (max. 6 Gbps)
It supports M.2 cards with a width of 22 mm
and a length of 42, 60 or 80 mm (type 2242, 2260, 2280).
Supports M.2 SSDs with SATA or PCI-Express interface
M.2-2230E slot for WLAN cards
Interfaces: PCI-Express Gen. 2.0 X1 and USB 2.0
Supports M.2 cards with a width of 22 mm and a length of 30 mm (type 2230)
Supports WLAN expansion cards (optional Shuttle accessory: WLN-M / WLN-M1)
Audio
Audio Realtek® ALC 897/662/888S High-Definition Audio
Two analog audio connectors (3.5 mm) on the front panel:
1) 2-channel line-out (head-phones)
2) microphone input
Digital multi-channel audio output: by HDMI and DisplayPort
Dual 2.5G LAN Controller
Dual network with two RJ45 ports with two status LEDs each
Used network chips:
2x Intel i225 or i226 Ethernet Controller (MAC, PHY)
PCIe interface
Supports Windows 10 Desktop OS and Windows Srv. OS
Supports 100 / 1.000 / 2.500 MBit/s operation
Supports WAKE ON LAN (WOL)
Supports network boot by Preboot eXecution Environment (PXE)
Front Panel connectors
Microphone input
Audio Line-out (headphones)
2x USB 3.2 Gen 2 Type A (red)
1x USB 3.2 Gen 1 Type A (blue)
1x USB 3.2 Gen 1 Type C
Power button
Power LED (blue)
HDD LED (yellow)
Back Panel connectors
2x HDMI 2.0b connector [1]
2x DP 1.4 connector (DP) [2]
Optional: 1x D-Sub VGA connector (Accessory PVG01 [4])
2x USB 3.2 Gen 2 Type A (red)
2x USB 3.2 Gen 1 Type A (blue)
2x 2.5G LAN (RJ45, Intel i225 or i226)
2x RS232 serial port, 9-pin D-Sub (5/12V, 1x RS422/RS485) [3]
1x DC-input connector for external power adapter (supports 19V±5%)
1x 4-pin connector (2.54 mm pitch) supports:
external power on button
Clear CMOS function
+5V DC voltage for external components
2x perforation for optional Wireless LAN antennas
2x hole for Kensington Lock
Other onboard connectors
1x jumper for power-on-after-power-fail (hardware solution) [7]
1x analog VGA graphics output CN6 (2x 10-pin, 1 mm pitch) [4]
2x serial interface (COM) occupied by back panel connectors
1x USB 2.0 (4-pin) for optional accessory WWN03 (LTE kit)
1x fan connector (4-pin) occupied by the cooling system
1x connector for CMOS battery (occupied)
Supplied Accessories
Multi-language Usr. guide (EN, DE, FR, ES, JP, KR, SC, TC)
VESA mount for 75/100 mm Std. (two metal brackets)
Four screws M3 x 5 mm (screws together VESA mount and PC)
Four screws M4 x 10 mm (to affix VESA mount on the PC)
Four screws M3 x 4 mm (to mount a 2.5" storage Dev. into the bay)
Two screws M3 x 5 mm (silver colour, to mount two M.2 cards)
Driver DVD (Windows 64-bit)
Serial ATA cable for 2.5" drive including power cable
External 120 W power adapter with power cord
Protection cap for CPU socket (do not use if heatpipe or fan is mounted)
Heatsink compound
Optional Accessories:
PVG01: optional D-Sub VGA video output [4]
WLN-M (802.11ac, Wifi 5) or WLN-M1 (802.11ax, Wifi 6): WLAN module in M.2-2230 format supports WLAN and Bluetooth with two external antennas.
WWN03: LTE adapter kit with antennas, but without LTE card
PS02: Stand for vertical operation
CXP01: adapter cable for external power button
PRM01: 2U rack mount front plate for two Shuttle XPC slim PCs
DIR01: DIN-Rail mounting kit
Environmental Specifications
Operating temperature range: 0~50 °C [6]
Relative humidity, non-condensing: 10~90 %
Certifications / Compliance:
EMI: FCC, CE, BSMI, RCM, VCCI
Safety: ETL, CB, BSMI
Other: RoHS, Energy Star, ErP
Conformity
This Dev. is classed as a technical information equipment (ITE) in class B and is intended for use in living room and office. The CE-mark approves the conformity by the EU directives:
(1) 2004/108/EC relating to electromagnetic compatibility (EMC),
(2) 2006/95/EC relating to Electrical Equipment designed for use within certain voltage limits (LVD),
(3) 2009/125/EC relating to ecodesign requirements for energy-related products (ErP)

Footnotes:

[1] HDMI output supports DVI-D with optional adapter
[2] How to convert DP into HDMI/DVI
The DP output can be converted to HDMI or DVI by an additional, passive adapter cable. For example:
DELOCK 82590: 1 m, DP (male, 20p) to HDMI-A (male, 19p)
DELOCK 82435: 5 m, DP (male, 20p) to DVI-D (male, 24p)
The integrated graphics automatically detects the connected display and puts out the appropriate electric signal either through DP (without an adapter) or HDMI/DVI (with an adapter).
However, a monitor with a DP connector cannot be connected to the HDMI port with a simple, passive adapter.
[3] Serial Ports
This PC features two serial RS232 ports with 9-pin D-Sub connectors at the back panel. The left COM port (COM1) can also be configured as RS422 and RS485 in BIOS.
Pin 9 of the D-Sub COM-Port is a multi-functional signal. Based on the Jumper JP1 configuration on the mainboard, it can be configured as Ring Indicator (RI) or external power supply with a voltage Lvl. of either 5 V or 12 V. Each COM port can be configured separately. The maximum current is 500 mA per connector.
[4] Optional D-Sub/VGA connector
The mainboard features one analog graphics port CN6 on the mainboard. This signal can be lead to the outside as a 15-pin D-Sub VGA connector on the back panel by using the optional adapter PVG01. However doing so means one serial port (COM) less can be used on the back panel. The integrated graphics supports a maximum of four displays simultaneously.
[5] Intel processors without integrated graphics (ID ends with "F", e.g. Core i7-12700F) are not compatible.
[6] Operating temperature
For high ambient temperatures over 40 °C we strongly recommend to use SSDs (supporting at least 70 °C) and rugged SO-DIMM memory modules with a temperature range of up to 95 °C.
[7] Power on after power fail
The BIOS setup provides a "Power-On after Power Fail" function that can be found under "Power Management Configuration". As the name indicates, this function determines the PC's behaviour after power failure: (1) unconditional power on, (2) restore former status or (3) keep system turned off. As a matter of the nature of this function, it may fail after short power failures. This is why the DH670V2 also comes with a HW-based solution. By removing Jumper JP2 (on the mainboard behind the power button) the system will start unconditionally once power is supplied.
[8] Optional Accessory WWN03 (LTE kit)
The Shuttle XPC accessory WWN03 allows this PC to be upgraded with an LTE/4G function for mobile network. The LTE card will occupy the 2.5" bay, so you will have to use an M.2 SSD as a mass storage Dev.. The required LTE/4G card in M.2-3042 format and an activated Nano SIM card is not included in the scope of delivery.
[9] TPM Function
This product features Firmware-TPM (fTPM) v2.0. Besides this, it is prepared for a HW TPM chip which can be fitted by factory on request if required.



 Confezione:  
  Peso Lordo: 10 Kg
Dimensioni Lorde: 100x300x200 mm
 
     
 Shuttle - Sito web:http://www.shuttle.eu  
     
     
   

 
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