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FANLESS SHUTTLE BOX-PC
WITH INTEL CORE ULV PROCESSOR IN A ROBUST CHASSIS
Shuttle's new generation BPCWL02 IPC Series in a ruggedized box design for high durability consists of compact fanless IPC systems with modular expansion for wide-range industrial applications.
Shuttle's new generation BPCWL02/03 IPC Series in a ruggedized box design for high durability consists of compact fanless IPC systems with modular expansion for wide-range industrial applications. The model BPCWL03 supports an extended operating temperature range of -20 to +60 °C. The Shuttle Box-PC series is offered as a complete system: either as a fixed configuration or as an customized BTO system.
Fanless and Silent
Equipped with passive cooling, no fan noise at all
Perfect to be used in noise-sensitive environments
Fanless, dust-free and thus virtually maintenance-free
24/7 Nonstop Operation
This Dev. is approved for 24/7 permanent operation.
Requirement: Free circulation of air amongst the PC must be guaranteed.
Chassis
Durable and rugged chassis made of aluminium and steel.
Passive cooling system with specially designed fins to maximize heat dissipation.
Dimensions: 16,9 x 24,5 x 5,7 cm (LWH) = approx. 2,7 litres
Weight: 2.85 kg net (Barebone without RAM/SSD and optional expansions)
IP-rating: IP30
Operating Position/Mounting
1) Desktop: The unit can be placed horizontally to stand on its feet.
2) VESA Mount: The unit can be affixed to a 75 mm x 75 mm VESA bracket. For this purpose, four M4x6L screws are required to be screwed into the chassis from the top.
3) Side Brackets (MRS01): The unit can be mounted using two optional 256 mm x 100 mm ear-mount brackets. For this purpose, four M3x6L screws are required to be screwed into the chassis from the bottom.
4) DIN-Rail (MDR01): Mounted on a Std. 35 mm DIN-Rail, e.g. inside equipment racks
Notes: VESA bracket, Ear-Mount and DIN-Rail clip are not included.
Vertical mounting is permitted in any orientation.
Operating System
This barebone system comes without operating system.
It is compatible with Windows 10/11 (64-bit) and Linux (64-bit).
Processor
Model: Intel Core i3-8145UE (ULV)
System-on-a-chip architecture (SoC) with integrated memory and graphics controller
FCBGA1528 package directly soldered onto the mainboard
Code name: Whiskey Lake-U (8th Generation Intel Core)
Cores / Threads: 2 / 4
Clock rate: 2.2 GHz, Turbo clock rate: 3.9 GHz
L3 Smart Cache: 4 MB
TDP wattage: 15 W maximum
Manufacturing process: 3rd-generation enhanced 14nm++
Integrated Graphics
Intel UHD Graphics 620
GPU clock frequency: 300~1000 MHz
Execution Units (EUs): 24
Supports up to three independent screens:
1) HDMI 1.4 on the backpanel
2) optional HDMI 1.4, DP 1.2, DVI-I or D-Sub/VGA (DDI interface)
3) optional D-Sub/VGA (eDP interface, limitations: no PnP support)
UEFI BIOS
Supports resume after power failure
Supports Wake on LAN (WOL)
Supports Power on by RTC Alarm
Supports boot from M.2 SSD cards and USB devices
AMI BIOS in 32 MB EEPROM with SPI interface
Supports HW monitoring and Watchdog function
Supports Unified Extensible Firmware Interface (UEFI)
TPM Module
HW Trusted Platform Module (Infineon SLB9670VQ2, TPM 2.0)
DC Connector: 5.5/2.5 mm (outer/inner diameter)
AC mains cable: 3 pins, ca. 1.8 m length, with C5/C6 coupler (called "Mickey Mouse" or "Clover-leaf") for the power adapter and CEE-7/7 plug with earth-contact (type E+F) for the power outlet
Note: The DC input voltage range can optionally be extended to Sup. 9-36 V.
Memory support
2x SO-DIMM slot with 260 pins
Supports DDR4-2400 (PC4-19200) SDRAM at 1.2 V
Supports Dual Channel mode
Supports a maximum of 32 GB per DIMM,
maximum total size: 64 GB
Supports two unbuffered DIMM modules (no ECC or registered)
M.2 Slot for SSDs
The M.2 2280 M slot provides the following interfaces:
- PCI-Express Gen. 3.0 X4
- SATA v3.0 (max. 6 Gbps)
It supports M.2 cards with a width of 22 mm
and a length of 60 or 80 mm (type 2260, 2280).
Supports M.2 SATA SSDs (with B+M key) and M.2 PCIe NVMe SSDs (with M key) with auto detect
Audio
Audio Realtek® ALC662 or ALC888S High-Definition Audio
Two analog audio connectors (3.5 mm) on the back panel:
1) 2 channel line out (headphones)
2) microphone input
Digital multi-channel audio output: via HDMI and optional DisplayPort
Dual Gigabit LAN
Dual network with two RJ45 ports
Used network chips:
1) Intel i211 Ethernet Controller with Mac, PHY and PCIe interface [3]
2) Intel i219LM PHY connected to the Mac of the processor
Supports 10 / 100 / 1000 MBit/s operation
Supports WAKE ON LAN (WOL)
Supports network boot by Preboot eXecution Environment (PXE)
Back Panel connectors
HDMI 1.4
4x USB 3.2 Gen 1 Type A (max. 5 Gbps)
2x Intel Gigabit LAN (RJ45, i211/i219LM) [3]
Serial COM port (RS232)
Microphone input (3.5 mm)
Audio Line-out / Headphones (3.5 mm)
DC-input connector for external power adapter (2.5 / 5.5 mm)
Optional Front Panel connectors
The front panel is subdivided into four sections to Sup. optional expansion kits with daughter boards in order to add I/O ports. Caution: Only suitably trained persons may open the barebone and install optional components!
1) second graphics port: HDMI 1.4 (DHD01), DP 1.2 (DDP01), DVI-I (DDV01) or D-Sub/VGA (DVG01)
2) third graphics port: D-Sub/VGA
3) one COM port RS232 (CRS01)
4) two COM ports RS232/RS422/RS485 occupies two sections (CSD01)
5) 4x USB 2.0 can be installed twice (Note: USB 2.0 ports allow up to 500mA/2.5W power output, but if only low power devices like mouse/keyboard are connected, then up to 4 USB kits can be used) (USB01)
6) 4x LAN ports with 2.5 Gbps transfer speed (IDL01)
7) up to four Digital I/O expansion kits, each with 4x Input and 4x Output (DIO11) [2]
8) Input for car ignition lock enables delayed on/off switching of the BoxPC (DIO11)
9) LTE kit with two external Antennas (LTE01). Not included: LTE card in M.2-3042 format (e.g. Huawei ME906S, Sierra EM7455, Quectel EM06E) and Nano-SIM card.
10) Terminal screws to connect a cable for an external Power Button (PWR01)
Further optional accessories
1) Wide range DC-input 9~36 V, instead of only 19 V (VOL01)
2) Ear-mount brackets, mounting dimensions: 256 mm x 100 mm (MRS01)
3) DIN-Rail clip (special clip has holes without thread) (MDR01)
4) WLAN module with two external antennas (WMAX2001+CWL01)
5) One LAN port in the backpanel can be upgraded to 2.5 Gb/s (IDL11) [3]
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